French website Nowhereelse.fr points to photos published by a WeiPhone forum user, which appear to be front and back of the next generation iPhone’s motherboard.
The purported next generation iPhone’s motherboard appears to be different from the one used in the iPhone 4S and iPhone 4.
The processor and other support chips are however missing from the motherboard pictured in these photos. It is widely expected that the next generation iPhone will come with a variant of the dual-core A5X processor that powers the new iPad.
iDeviceGuys – iPhone parts specialists have noticed that the SIM card slot appears to be smaller in size than the iPhone 4S and iPhone 4, which could indicate that the new iPhone will need a nano-SIM as reported earlier.
The repair firm also reports that the battery connector has five pins, compared to four pins on the iPhone 4S, which may point to support for 4G LTE network.
They also noticed that the digitizer connector for the display has been tweaked, which may point to the use of new screen technology in the next iPhone. According to rumors, Apple is planning to use in-cell touch panels in the next generation iPhone that could allow it to make it thinner than iPhone 4S.
Nowhereelse.fr notes that the screw holes of the motherboard matches with the unibody back panel that was leaked previously. They’ve also created a gif that compares the size and the connections of the motherboard in the photos to the parts that were leaked earlier.
It is difficult to confirm the authencity of the photos, but as 9to5Mac points out the same user had posted legitimate photos of iPhone 4S’ motherboard in August 2011, two months before it was launched.
[WeiPhone via 9to5Mac, Nowwhereelse.fr]
