Apple’s upcoming iPhone 6c will take advantage of advanced “FinFET” processors to deliver increased performance alongside greater power efficiency, a new report claims. But the device won’t be launching this fall as originally anticipated.
A recent report claimed Apple has scrapped plans to launch an iPhone 6c this year, and any evidence of the device has not appeared in its supply chain since March. This could be because Apple has pushed the handset’s launch back to the second quarter of 2016, according to a new DigiTimes report.
A reason for this delay isn’t given, but perhaps Apple wants is smaller, more affordable iPhone to be released on a separate release cycle to distance it from its flagship siblings — and to make demand easier to manage when new iPhones go on sale in the fall.
DigiTimes adds that the iPhone 6c will use an advanced “FinFET” processor manufactured using either a 14- or 16-nanometer process, allowing it to deliver increased performance and greater power efficiency.
“The 14/16nm FinFET chips will be manufactured by Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung,” reads the report. “The original plan was to equip the devices with chips built using TSMC’s 20nm SoC process, said the sources, but the adoption of FinFET processors would enable specs upgrade and lower power consumption.”
The iPhone 6c is expected to bring a new metal form factor and a 4-inch display that will make it an ideal alternative for those who do not want a larger iPhone.