Korean news agency ETNews claims that Apple plans on applying individual Electromagnetic Interference shields to a number of key components on the iPhone 7 and iPhone 7 Plus to reduce electromagnetic interference.
The company has decided to take this move to further increase the performance of its devices, while reducing the electromagnetic interference that occurs due to the increased clock signal of chips. Additionally, this will further help in reducing the electromagnetic waves that are emitted from the phone, which should alleviate fears that some people have.
In addition to the PCB and its connector, the report claims that Apple will also be applying EMI shields to major chips meant for connectivity (Wi-Fi and Bluetooth), RF, and the AP (Application Processor). This will increase Apple’s overall production cost though. Apple has apparently been working on this project since the last year and has personally chosen the equipments that its partners will use for this process. For now, the company has given the EMI shielding contract to StatsChipPac and Amkor, with each contract being worth tens of millions of dollars.
Like with any other rumor related to the iPhone 7, I’d recommend readers to take this one with a big pinch of salt, especially since this is the first time we are hearing about this. Do you think Apple will apply individual EMI shields to key chips inside the iPhone 7 and iPhone 7 Plus?