With the “iPhone 7” looming in the distance, the Rumor Mill is more than willing to toss out little tidbits for what to expect in the next flagship from Apple.
The latest morsel comes from The Electronic Times, and tries to shed some light on which manufacturing partner will be chosen to bring the next-generation processor that powers the next iPhone to market. According to the report, the Taiwan Semiconductor Manufacturing Company, or TSMC, has inked a deal with Apple to be the only manufacturer that build the next chipset for Apple’s flagships.
For the iPhone 6s and iPhone 6s Plus, TSMC shared the manufacturing duties with Samsung — which led to some interesting results soon after the phones made their way to the public. For the iPhone 6 and iPhone 6 Plus’s A8 processor, TSMC was the sole manufacturer, so this could be a return to what TSMC probably views as the norm.
The report goes on to say that TSMC was able to edge Samsung out of the bidding due to its 10-nanometer manufacturing technology. According to the publication, TSMC will go into full production sometime in June, and the iPhone 7 is expected to launch sometime in September.
The differences between the Samsung-manufactured A9, and the one put together by TSMC were varied, with many reports surfacing that showed the latter company’s chip actually running cooler than the former’s. The reports grew in intensity and numbers, and eventually Apple commented on the perceived issue, saying:
“Our testing and customer data show the actual battery life of the iPhone 6s and iPhone 6s Plus, even taking into account variable component differences, vary within just 2-3% of each other.”
There’s no telling if last year’s “issues” played a part in this year’s decision, but of course there is plenty of room and time for speculation across the board.
Are you getting excited for the iPhone 7?
[via The Electronic Times]Like this post? Share it!