The “iPhone 7” isn’t an official device by any means just yet, as we’re still months away from an announcement, but that hasn’t stopped some schematics reportedly depicting the upcoming handset from making an appearance.
The Japanese magazine Mac Fan has shared details of an upcoming device that’s being called the “iPhone 7 Pro” in its magazine, including what’s reported to be the design schematics for the upcoming handset. The magazine states that the iPhone 7 Pro will feature the overall size dimensions of the iPhone 6s Plus, and that it will boast dual iSight cameras on the back, and won’t feature a 3.5mm headphone jack, either.
One interesting part revealed by the schematics is that the iPhone 7 Pro will reportedly measure in at 7.3mm thick, which is exactly the same size as the iPhone 6s Plus. That’s an interesting detail, considering many of the rumors surrounding Apple’s decision to remove the 3.5mm audio jack is to make it even thinner than the current generation devices. If these schematics are real, then that’s not what’s happening.
However, keeping the same thickness could be explained due to the dual-camera system on the back of the handset. The report indicates that Apple is including two iSight cameras on the back, but it doesn’t divulge any additional information.
The image embedded with the schematics does show what appears to be a Smart Connector, near the bottom of the handset, too, which lines up with earlier rumors as well.
The “Pro” designation is a bit different for the iPhone lineup, so it will be interesting to see if Apple goes with it later this year. Do you prefer “iPhone 7 Pro” or “iPhone 7 Plus?”