Digitimes reports that TSMC has managed to beat Samsung in securing orders for Apple’s A11 chipset that will power the iPhones in 2017. In addition to fabricating A11 chips, TSMC will also be providing its backend integrated fan-out (InFO) water-level packaging technology for the chips.
The Taiwanese company managed to secure the order for the latter by beating out companies like Amkor Technology and other companies that specialise in this technology. Digitimes sources also claim that TSMC has been contracted by Apple to manufacture OLED driver ICs for the 2017 iPhone, with the OLED panels being sourced by “Korea-based panel vendors.”
TSMC with its 10nm process technology is believed to have obtained orders for Apple’s A11 processor which will power the 2017 iPhones, said the sources. The Taiwan-based foundry will also offer its backend integrated fan-out (InFO) wafer-level packaging (WLP) technology for the 10nm A11 chips beating Amkor Technology and other backend specialists, the sources indicated.
With the 2017 iPhone unveiling more than a year away and Digitimes flaky track record, I will recommend readers to take this news with a pinch of salt. It is unlikely that Apple will zero in on suppliers for key components of the 2017 iPhone so soon.