With iPhone 8’s launch reportedly on track for September, TSMC has started production of Apple’s A11 processor on its 10nm fabrication process.
The Taiwanese company has managed to overcome production issues that involved stacking components in the backend integrated fan-out (InFO) packaging process. These issues were earlier proving a bottleneck for TSMC, but now that they have been solved, the company has begun producing Apple’s A11 chip.
TSMC has begun 10nm chip production for Apple’s next-generation iPhone 8 series, the sources said. Production was once affected by issues involving stacking components in the backend integrated fan-out packaging process, but they have already been solved, the sources said.
The new packaging process will make the chips and the PCB of the iPhone 8 thinner than usual. This should allow Apple to fit in a higher capacity battery on the new iPhones for better battery life. A previous report claimed TSMC will reportedly start delivering A11 chips to Apple from late June.
While Apple used sourced the production of its A10 chip to both Samsung and TSMC, it has exclusively contracted the latter to supply A11 chips this year.
Apple is expected to use its faster and more power efficient A11 chip on all the three new iPhone variants it plans on launching this year. Apart from the A11 chip, the three new iPhone models are also expected to feature wireless charging and a glass design. While Apple will be launching three new iPhones this year, it is the OLED iPhone 8 variant that will be stealing the show. It will reportedly come with a bezel-less design, a virtual home button, and a Touch ID scanner integrated into the display.