With less than a month until Apple is expected to unveil the iPhone 6, another picture of what appears to be a fully assembled logic board for the next-generation smartphone has surfaced. The photo reveals several different internal components that could power the iPhone 6.Â
A new report claims that Apple manufacturing partner Pegatron has been awarded a contract that will see it produce 50-percent, or 25 million, of the estimated 50 million 4.7-inch iPhone 6 units to be shipped this year.Â
While the highly-anticipated iPhone 6 is expected to be unveiled in just a matter of weeks, there are some still manufacturing steps that Apple is working through to ensure that the upcoming smartphone is ready to go on sale to the public.Â
As we inch towards September and the long-anticipated release of the iPhone 6, the well-sourced blogger Sonny Dickson has shared more high-resolution photos of the purported rear shell for the next-generation smartphone.Â
With the oft-rumored iPhone 6 expected to be unveiled next month, the number of component leaks for the upcoming smartphone is beginning to get exhaustive. But here’s one more look.Â
We are now less than a month away from the official unveiling of the next iPhone, oft-rumored the iPhone 6. But, since we’re not there yet, we’re still well into the season of the leak, and a new image of the iPhone 6′s purported front panel has made it to the surface.
The only thing that we’ve got as a guarantee at this point, and even that’s not really locked in (because things can change on the fly), is that Apple’s having an event on September 9. Until then, though, the inside reports on what’s coming will continue to flow in.
Last month, the leaked photo of purported iPhone 6 battery had revealed that the next generation iPhoneÂ wouldÂ offer minimal improvements in battery life.